Reservation  -     

Center of MicroNanoTechnology CMi

SPIDER 600
HOW TO PROCEED ?

  1. Determine what you need.
    1. Films to deposit in SPIDER600 ?
    2. Substrate temperature during deposition ?
      • Room temperature (20C nominal, no heating, temperature up to 60C) ?
      • Intermediate temperature (60C - 130C) ?
      • Hot temperature (130C - 350C) ?
    3. Substrate cleaning before deposition (RF-etch) ?
    4. Film densification during deposition (RF-bias) ?
  2. Determine if you can use the SPIDER (Access restrictions).
    • Substrates ?
      • Silicon or Quartz ?
      • Pyrex or Float Glass ?
      • Other ?
    • Films already deposited ?
      • Microelectronic compatible ?
      • Gold or Copper ?
      • Resist or Polymer ?
    • Access restrictions ?
      • see the table below.
  3. Estimate roughly the total duration.
    • Total number of wafers (wafers to be processed + wafers for target cleaning) ?
    • Thicknesses, deposition time for each film ?
    • Intermediate / Hot temperature stabilization time ≈ 90 minutes
    • Transfer time ≈ 1 minutes 20 secons per transfer and per wafer,
      for example : load-lock → PM1 → PM2 → load-lock = 3 transfers per wafer ≈ 4 minutes per wafer.
    • Process time for a target cleaning  ≈ 4 minutes.
    • Process time for a wafer cleaning ≈ 7 minutes (2 minutes RF-etch + 5 minutes temperature stabilization).
    • Deposition time ≈ 30 seconds for gas stabilization + calculated time versus deposition rates and thicknesses.
    • Real duration should be lower than your rough estimation, because some operations are done in parallel.
    • The last process launched in the evening can finish in the night (but must finish by 03:00 am for cooling down).
  4. Make your reservations:
    • Select "Z4-SPIDER 600 - Sputter multi-chambres"
    • Select Wafer size, Targets, Substrate holder temperatures.
    • If a time slot corresponds to your needs and is free, you can book it.
  5. Ask for a configuration (wafer size, targets, deposition temperatures) :
    • If some time slots don't fit perfectly to your needs and are compatible, you can ask for a configuration by clicking in the corresponding boxes and then by clicking on the button "Envoyer la demande de configuration" to send the request for a target up-dating.
    • Then you'll receive an acknowledgment as soon as the target calendar has been up-dated.
    • Because CMI receives a lot of request, it's possible that your wishes are not taken into account, in that case, redo a configuration request for another slots.

ACCESS RESTRICTIONS

Substrate
Clean Si or Quartz
Clean Pyrex or float glass
Other
Films already deposited
No film
class I
class II
Contact a responsible : CMI's agreement required
Micro-electronic compatible films (SiO2, SixNy, TiO2, Al, AlSi, Si, Ti, Ta, Mo, Pt, …)
class I
class II
Organic films (resist, polymer, …)
class III
class IV
NON microelectronic compatible films (Au, Cu, Ag, …)
class IV
class IV

 

PM1
PM2
PM3
PM4
class I

Access

YES
YES
YES
YES

High T°

OK
OK
OK
OK

RF-Etch

OK
OK
OK
OK

RF-Bias

OK
OK
OK
OK
class II

Access

YES
YES
YES
YES

High T°

OK
OK
OK
OK

RF-Etch

NO
NO
NO
NO

RF-Bias

NO
NO
NO
NO
class III

Access

YES
NO
YES
YES

High T°

NO
N/A
NO
NO

RF-Etch

OK
N/A
OK
NO

RF-Bias

OK
N/A
OK
NO
class IV

Access

YES
NO
YES
YES

High T°

NO
N/A
NO
NO

RF-Etch

NO
N/A
NO
NO

RF-Bias

NO
N/A
NO
NO