Reservation  -     

Center of MicroNanoTechnology CMi

Procedure for RCA cleaning

Table of contents

  1. Request for a RCA cleaning
  2. Put your wafers in zone 3
  3. Cost of an RCA cleaning
  4. Pick up your wafers
  5. Measure your wafers

I. Request for a RCA cleaning Haut CMI

On the web interface for reservations, click on "RCA request"

  1. "RCA date" : Select a date for the requested RCA cleaning.
  2. "Account" : Select one of your accounts. You can add a lot with another account
  3. "Wafer" : Describe your lot of wafers.
    • Number of wafers
    • Substrate
      • Silicon.
      • Fused silica.
      • Other : To be specified in "Remark".

      • N.B. : >>>>>>>>>>>> No Float Glass ! No Pyrex ! <<<<<<<<<<<<

    • Size of wafers
      • 100mm diameter.
      • 150mm diameter.
      • Other : To be specified in "Remark".
  4. "Wafer ID" : Give the ID numbers (especially if you need a split of the batch of wafers)
  5. "History" : Give a brief description of the history of the wafers
    • Your wafers have to be clean :
      • >>>>> No resist <<<<<: REMOVER + O2 PLASMA (OXFORD!) done by the user before giving the wafers to the CMI staff for an RCA !
      • >>>>> No metal <<<<<: Wafers must be metal free ! Wafers after metal stripping are not considered metal free !
      • >>>>> No potassium <<<<<: KOH decontamination done by the user before giving the wafers to the CMi staff for an RCA !
    • Give a brief description of the process flow
      • Photolithography step + etching
      • Cleaning
      • Metal layer deposition + stripping method + cleaning
      • KOH etching + decontamination
  6. "RCA type" : special feature for the RCA cleaning
    • full : RCA1 + HF1:10 + RCA2 + SRD
    • without HF : RCA1 + RCA2 + SRD
    • without SRD : RCA1 + HF1:10 + RCA2 + drying at air
    • without HF & SRD : RCA1 + RCA2 + drying at air
    • RCA 2 only : Piranha (done by the user) + RCA2 + SRD
    • Other : To be specified in "Remark"
  7. "Thin-film requested" : Please refer to the Centrotherm recipe list

II. Put your wafers in zone 3 Haut CMI

  1. Your wafers have to be clean :
    1. Only silicon or fused silica (quartz) wafers : No float glass, no Pyrex
    2. No resist : REMOVER + O2 PLASMA (OXFORD!) done by the user before giving the wafers to the CMi staff for an RCA !
    3. No metal
    4. No potassium : KOH decontamination done by the user before giving the wafers to the CMi staff for an RCA !
  2. Put your wafers in a black box, labeled with your name and the description of the processes to do.
  3. Please do not leave other wafers in the black box to avoid any confusion.
  4. Leave your black box in zone 3, on the stainless steel table in front of the RCA wet bench ; at place labelled "RCA IN", .
  5. Deadline: 14:00 the working day before the RCA cleaning
    • usually : Tuesday 14:00 for a RCA cleaning on Wednesday
  6. Your wafers are not ready at time:
    • You are not authorized to load your wafers in the Teflon cassette by yourself
    • Your request for an RCA cleaning is cancelled
    • You will be charged for the RCA cleaning

III. Cost of an RCA cleaning Haut CMI

  1. An RCA cleaning done by CMI staff is charged:
    1. Machine: 20 minutes per batch
    2. Labor cost: 30 minutes per batch
  2. Definition of one batch of wafers: A batch of wafer can be loaded in the same Teflon cassette. It means that one batch is:
    1. less than 25 wafers
    2. homogeneous in size
    3. homogeneous in treatment for the RCA cleaning

IV. Pick up your wafers Haut CMI

  1. Your wafers will be carried out by CMI for the RCA cleaning and for thin film processes.
  2. As soon as wafers are unloaded from one tube, a logout is done. Then you can see in the web interface, on "My bill" a line which corresponds to the run.
  3. As soon as the last step is performed, your wafers are ready on the delivery shelf in front of zone 6, in the user corridor.
  4. Exception : After a POCl3 doping , wafers are unloaded in a Teflon cassette which is inside a black box labeled "POCl3".
    1. A deglazing must be done before doing anything else.
    2. It's strictly forbidden to handle any wafer before the deglazing.
    3. The black box labeled "POCl3" with the Teflon cassette is available on the table in front of the RCA wet bench.

V. Measure your wafers Haut CMI

  1. Even if CMI does the best for you, an error can occur : misunderstanding in the process definition, human error, technical error during a process,... we recommend you to check by yourself if thicknesses of films are correct.
  2. Measurement tools :
    1. NANOSPEC 6100 : Spectroscopic reflectometer.
    2. SOPRA GES 5E : Spectroscopic ellipsometer.