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Operation Manual for the ATMsse OPTIhot VB20 HMDS Hotplate

Operation Manual for the ATMsse OPTIhot VB20 HMDS Hotplate

 

Contents

  1. Introduction and safety
  2. Equipment description
  3. Operation
  4. References

 

  1. Introduction and safety
  2. The ATMsse hotplate is available for batch priming of Si oxide (native or film) to enhance surface adhesion of polymers, such as positive photoresist. The material used in this system is Hexamethyldisilazane (HMDS - C6H19Si2N), extensively applied for photoresist priming on Si and SiO2 substrates.

    The equipment is also available for cleaning substrates; please see staff for details on this mode of operation.

    Note: there is a risk of physical injury as the surface is constantly heated to 125 °C - be careful while handling wafers. Use metal weezers only. After the process has finished, allow wafer to cool down before loading back to cassette.

    Access login and booking

    Booking or login is not necessary to use the equipment.

    Standard user check list

    • Check that the controller is ready. Make sure that the recipe HMDS STANDARD (or HMDS NO DEHYDRATE) is loaded for the HMDS process.
    • Pressure gauge on right must show atmosphere.
    • Chech wafer backside and hotplate surface, clean if necessary.

    Cross-contamination issues

    • The sample and resist used must be accepted by the technical comittee in advance. Samples must be free of backside contamination.
    • Inspect hotplate surface and backside of wafer, clean accordingly to remove any solid or liquid residues.

     

  3. Equipment description
    • Vapor prime hotplate system for wafers up to 200 mm and plates up to 150 mm x 150 mm with touchscreen interface, programmable process parameters (HMDS, nitrogen and vacuum)
    • Temperature range: up to 200 °C
    • Hotplate timer: 1 s to 999 s, adjustable in 0.1 s steps
    • 20 recipes and 38 steps per recipe are available

     

  4. Operation
  5. Make sure that the controller unit is operational and in standby state. Check that the system is showing the main menu as below, and recipe HMDS STANDARD (or HMDS NO DEHYDRATE) is loaded for HMDS processing.

         

    Load substrate onto the hotplate and close the cover. Select AUTOMATIC to enter recipe menu and prepare to start process.

       

    Press Start on the touchsceen or the (I) button next to the cover to begin process. Processing will start with a vacuum valve opening, followed by multiple purge steps. HMDS exposure is 10 s. After the final purge step the cover may be opened. Use a tweezer to remove the wafer. Check hotplate surface and clean if necessary. Close the cover when done.

         

    The system is available for different recipes; please check with CMi staff for details. The recipe page can be accessed by pressing the Recipe button in standby mode. New recipes can be manually programmed or loaded from a USB drive.

       

    In case a problem occurs, the process can be stopped at any time.

    • Press the STOP key on the display or <0> on the control panel during the process.
    • An automatic cleaning step is executed.
    • Remove the substrate with tweezers.
    • Notify staff.

     

  6. References