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Center of MicroNanoTechnology CMi

Mask Fabrication

 

Mask Fabrication

Mask fabrication is an established standard process available in the CMi CM-1 cleanroom. The process flow below describes process parameters, steps of operation and equipment used. The current process uses the VPG200 laser writer and the Hamatech HMR900 Mask Processor. For the alternate, old-school process using the DV10 developer station and Colliard wet benches, scroll down at the bottom of the page.

 

Step information / Cross section Equipment Recipe / Parameters

Starting material:
Standard Cr-blank (Nanofilm)

 

 cmi.epfl.ch

Commercial plates (Nanofilm) are available in standard sizes (5x5 inch for exposure on 100mm wafers, 7x7 inch for exposure on 150mm wafers, 4x4 inch for exposure on small wafers & piece parts).


Order at least 24h in advance

Laser writing:
DWL write

 

Z5 - VPG200

 

Development (diluted AZ 351B) & Rinse:

Cr blank develop

Cr etch & Rinse:

Mask Cr etching

Resist strip (AZ 400K) & Rinse:

Mask PR stripping

 

Z6 - Hamatech Mask Processor

Equipment preparation (purge):

  • Recipe N°8 = LINES PURGE

Mask processing:

  • Recipe N°1 = DEV/ETCH/STRIP

Inspection

Z6 - Microscope

A transmission microscope is available in Zone 6.

Final use

Use mask for image transfer

 


Note that the image of the written data is mirrored over the Y axis.


   Alternative Mask Fabrication Process (VPG200/DV10/Colliard)