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Center of MicroNanoTechnology CMi

AZ9200 Surface Prep.


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AZ 9200 Surface preparation


Wafer Surface Preparation

Usually adhesion of photoresist on inorganic materials is poor resulting in losses of fine structures after development. To solve the issue, silicon wafers are generally treated using the HMDS vapor prime treatment before spincoating the photoresist. Details about the HMDS process and control can be found here: link

In general, assuming wafers with clean surface without organic contamination, good adhesion of AZ 9200 is observed with the following surface treatments:

Surface material (larger area) Vapor HMDS Plasma O2 Thermal dehydratation
Si √√
SiO2, fused silica, SiN, Si3N4 √√
Float glass, pyrex √√
Metal Al √√
Metals Ti, Cr, Ta X √√
III/V semiconductors (GaN, GaAs) X √√

Note: Cleanroom relative humidity control is critical for resist adhesion.


Below is the list of cleanroom equipment available for each surface treatment. Contact the staff responsible of each machine for specific questions and training requests.

Vapor HMDS

The ACS200 Gen 3 automatic coating system in Zone 1 has a built-in HMDS hotplate module. For other coating equipments, please use the standalone HMDS primer systems listed here :

Plasma O2

Thermal dehydratation

A dehydratation step is included as an option in the EVG150 and ACS200 Gen 3 automatic coaters. In addition, hotplates and ovens are available in all photolithography zones in order to perform thermal dehydratation on single or batch wafers. Please contact the photolithography staff for guidance.

Sources & Links