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Center of MicroNanoTechnology CMi

CMi used Photoresist

 

Photoresist Selection Photoresist Table Equipment Compatibility Definitions

Photoresist Table

The following table is a list of photoresists currently available at CMi. For more information:

Please note that unlisted photoresists (from any supplier) can generally be coated in CMi on manual spin-coaters (SSE SB20 and Süss RC-8) once the MSDS has been reviewed and the procedure (SOP) has been approved by the CMi. Contact the photolithography staff in case of questions.

Polymers that are not photosensitive or with special chemistry can be coated in Zone 13 on the Laurell manual coater line.

Planar or very low topography substrate

Standard positive tone
Coating Tools
Recommended Exposure Tools
Thickness range [m]
Developer / maximal AR
Recommended Process
AZ ECI 3007 ACS 200
RiteTrack 88
MA6 (CI1), MJB4
VPG 200
T = 0.6 ... 1.5 AZ 726 MIF, MF CD-26 (TMAH)
AR ~ 2:1
prf. AZ ECI
AZ 1512 HS ACS 200
EVG 150
MA6 (CP)
MLA 150
T = 1.1 ... 2.5 AZ 726 MIF
AR ~ 1:1
prf. AZ 1512 HS
AZ 9207
(diluted AZ 9260)
ACS 200
MA6 (CI1)
MLA 150
T = 0.65 ... 0.85 AZ 400K : H2O / 1:3.5 (KOH)
AR ~ 1:1
prf. 9200
Unlisted positive RC-8
SSE SB20
       
Lift-Off Processing
Coating Tools
Recommended Exposure Tools
Thickness range [m]
Developer / maximal AR
Recommended Process
LOR 5A bi-layer with AZ 1512 HS ACS 200 MA6 (CP), MJB4
MLA 150
T= 0.4+1.1 / 0.8+1.6 AZ 726 MIF
AR ~ 1:1
prf. LOR 5A 
AZ nLOF 2020 EVG 150 MJB4
VPG 200
T = 1.4 ... 3.0 AZ 726 MIF
AR ~ 2:1
prf. nLOF 2020

Medium topography substrate

Standard positive tone
Coating Tools
Recommended Exposure Tools
Thickness range [µm]
Developer / maximal AR
Recommended Process
AZ ECI 3027 ACS 200
RiteTrack 88
MA6 (CI1), MJB4
VPG 200
T = 2.0 ... 5.0
AZ 726 MIF, MF CD-26 (TMAH)
AR ~ 3:1
prf. AZ ECI
AZ 9221
(diluted AZ 9260)
ACS 200
RiteTrack 88
MA6 (CI1)
MLA 150
T = 2.0 ... 4.0 AZ 400K : H2O / 1:3.5 (KOH)
AR ~ 2:1
prf. 9200
AZ 9260 ACS 200
EVG 150
MA6 (CI1)
MLA 150
T = 5.0 ... 20.0 AZ 400K : H2O / 1:3.5 (KOH)
AR ~ 5:1
prf. 9200

High topography substrate

Standard positive tone
Coating Tools
Recommended Exposure Tools
Thickness range [µm]
Developer / maximal AR
Recommended Process
Spray coating
(conformal AZ 9260)
EVG 150 MA6 (CI1) T ~ 3
AZ 400K : H2O / 1:3.5 (KOH)
AR ~ 1:1
 
Multi-layer AZ 9260 EVG 150 MA6 (CI1)
MLA 150 (thickness < 50 µm)
T = 20 ... 60

AZ 400K : H2O / 1:3.5 (KOH)
AR ~ 5:1
prf. 9200
AZ 40XT ACS 200 MA6 (CI1)
MJB4
VPG 200 (thickness < 50 µm)

T = 15 ... 90

AZ 726 MIF, MF CD-26 (TMAH)
AR ~ 8:1
prf. 40XT
Structural material
Coating Tools
Recommended Exposure Tools
Thickness range [µm]
Developer / maximal AR
Recommended Process
SU-8 : Sawatec LSM MA6 (CI1), MJB4
VPG 200 (thickness < 50 µm)
MLA 150 (thickness < 50 µm)
T = 0.8 ... 300 PGMEA
AR ~ 10:1
prf. SU-8

SU-8 Runcard

Polymer used as structural material

Structural material
Coating Tools
Recommended Exposure Tools
Thickness range [µm]
Developer / maximal AR
Recommended Process
Polyimide PI 26xx series Sawatec LSM200 (Z1) Not photosensitive T = 1 ... 10 Not photodefinable, patterning with SiO2 hard mask prf. PI

PI 26xx Runcard

Unlisted polymer (non-photosensitive) Laurell Coater (Z13) Not photosensitive      

 

Photoresist Selection Photoresist Table Equipment Compatibility Definitions