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Operation Manual for Suss MicroTec MJB4

Süss Microtec MJB4 Mask & Wafer Aligner

MJB4_intro

Precautions and Warnings

The sample and resist used must be accepted by the technical comittee in advance and samples must be free of backside contamination. Staff approval is required before using any non-standard products.

Cross-Contamination: Mechanically unstable metal layers (delamination) are not allowed. The photoresist should correctly cover any wafer topography. Inspect chuck and mask after each session. Clean with soft tissue to remove any solid or liquid residues.

Note: One special chuck is available for use with unstable or contaminating PDMS coated wafers. Please ask the CMi staff for guidance.

Table of content: CMI

  1. Introduction
  2. Equipment Description
  3. User Manuals
  4. Links

I. Introduction CMI

The MJB4 is a mask/wafer aligner for research and development, designed to align and expose wafers up to 4 inch (100 mm) diameter. Wafers, coated with photosensitive resists (PR), are exposed through a glass/chrome mask using a short (few seconds) pulse of UV radiation from a mercury (Hg) lamp, with spectral lines at 365nm, 405nm and 436nm. The illumination configuration is i-line (filter installed), meaning only the 365 nm spectral line is absorbed by the resist.

The parallelism between the wafer and the mask is achieved with a semi-automatic procedure of Wedge Error Compensation (WEC). Alignment is achieved with manual micrometer knobs down to a precision of about 0.5 µm. Only the top side alignement option is available.

The resolution is limited by light diffraction through the mask opening, and can reach a minimum of about 800 nm with thin PR thickness (< 1 µm).

II. Equipment description CMI

Configuration:

MJB4 (Mask Aligner)
The MJB4 is a mask to wafer alignement and exposure system. One alignment modes is available: Top side alignment (TSA). The MJB4 is equipped with several options for fine handling of small wafers/chips.

Default illumination setup for exposure: 20 mW/cm2 @ 365 nm (i-line).

Mask holders: Three different mask holders are equipped with vacuum clamping:


Mask holder for 5” Cr blanks

Mask holder for flexible masks

Mask holder for 4” Cr-blank,
50mm wafer (several center positions)

Chucks available: Three different chucks for all sizes:


Standard 4” chuck

Substrate from 10x10 mm
up to 20x20 mm

2” chuck

Note: chucks can be used for wafer/substrate thicknesses from 0.1 mm up to 4.0 mm.

Small wafer objectives:

MJB4 is equipped with offset objectives for alignment of small wafer/chips. Minimum separation is 10mm.


11x offset objectives: working distance is 14.1 mm; minimum separation is 10 mm.

Technical Caracteristics:

III. User Manuals CMI

IV. Links CMI