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Center of MicroNanoTechnology CMi

Dataplate Fr)

 

DataPlate - Programable Hotplate

IMPORTANT NOTES:

Associated hotplates for processing negative resist are:

Dataplate is a programmable hotplate for general use. Exhaust and protection cover has been added for processing with moderate rate of solvent evaporation. Soft-baking of freshly coated wafers is tolerated. Use in priority Sawatec HP401Z


DATAPLATE hotplate


Dedicated programmable hotplate for NEGATIVE resine. Replace original  Factum hotplate on RC8 THP manual coater.

Application

  • For controlled heating and cool down rate. Up to 200C. For example SU-8
  • Shorter bake time than 5 min. in manual mode only

Manual Mode

TEMPERATURE LIMIT: Max 220 C, Cover shield closed

Display function

HP need to be ON  (On/Off Switch)
Display shows actual temperature. Heater is OFF (default)
Heater: Press PLATE TEMP (1)
Timer: Press TIMERHR:MIN  (4) or TIMER MIN:SEC (5)

Set function

Press SET/ENTER followed by:

PLATE TEMP (1)  + Setpoint in deg C  OR
TIMER HR:MIN (4) + Time in hr:min OR
TIMER MIN:SEC (5) + Time in Min: Sec OR
RAMP (8) + value in deg/min (max 555) OR
Heater OFF  to switch down heating
AUTO-OFF key will turn off the heater after the timer will reach zero
HOLD will store target settings after power as been set OFF and ON.  DO NOT USE THIS FEATURE any time for safety reasons.

Finish entry by ENT or abort entry with CLR


Programmable Mode

Plates is protected by an Aluminum foil. No additional paper between plate and wafer is needed

TEMPERATURE LIMIT: Max 200 C, cover shield closed

To edit a program

HP need to be ON  (On/Off Switch)

Press Edit
Step 00 appears

Option I:  Edit a new program, Press CLR  (clear old program)
Option II:  Edit a step:  Press STEP UP (8) or STEP DOWN (7)  to read program. Use OMIT to erase one step (except step 00). Use SET/ENT/WAIT UNTIL  key to insert a step AFTER the current one.

Programming step:
DISPLAY type step -> To change display type between PLATE TEMP (1), TIMER (4 or 5)

SET Target value:
SET (1x, display turn to |_  |_  |_  |_ ) followed by PLATE TEMP (1) or TIMER (4 or 5) followed by value
Immediatly set target value and continue to next step.

Wait Until type step:

WAIT UNTIL, WAIT UNTIL (2x, display turn to |_|  |_|  |_|  |_|) followed by PLATE TEMP (1) or TIMER (4 or 5) followed by value.
Delayed action, program execution pause until temperature has been reached or timer falls to zero.

HEATER OFF step:
Turn heater off immediatly

To Run a program.

  1. Pressing RUN will start the program. Lamp under this key will light during execution.
  2. If necessary a program can be cancelled by RUN (light turn off)
  3. Program resides in memory until EDIT/CLR is pressed

Program example

TEMPERATURE LIMIT: Max 200 C, cover shield closed

I) Simple rampe from ambiant to target temperature, priority to temperature control

STEP

 KEYSTROKE SEQUENCE

 EXPLANATION

01 Wait Until, Wait Until, TIMER MIN:SEC (5), 1, 5, ENT Wait 15 s.
02 SET, Ramp/HR (8), 6, 0, ENT Set ramp value to 1 deg/min.
03 PLATE TEMP Dispaly plate temperture
04 Wait Until, Wait Until, PLATE TEMP (1), 6, 5, ENT Wait until plate temperature = 65C
05 Wait Until, Wait Until, TIMER HR:MIN (4), 3, 0, ENT Set 30 minute delay
06 HEATER OFF (9) Turn heater off
07 SET, TIMER HR:MIN (4), 1,2, ENT Start a timer 12min
08 TIMER MIN:SEC Display timer in MIN:SEC format

II) Double plateau bake with slow cooling down (SU8)

SET, PLATE TEMP (1), 4, 5, ENT:  Prepare plate during SU8 coating (45C)
Start program when needed

STEP

 KEYSTROKE SEQUENCE

 EXPLANATION

01 SET, TIMER MIN:SEC (1), 6, 30, ENT Set a timer for control (6min:30sec)
02 SET, Ramp/HR (8), 3, 0, 0, ENT Set ramp value to 5 deg/min.
03 TIMER  (5) Dispaly timer
04 Wait Until, Wait Until, PLATE TEMP (1), 6, 3, ENT Wait until plate temperature = 63C
05 SET, PLATE TEMP (1), 6, 5, ENT Set target plateau #1
06 Wait Until, Wait Until, TIMER MIN:SEC (5), t1+2, 0, , 0,ENT Priority to time t1 plateau #1 (t1 + 2 min.)
07 SET, Ramp/HR (8), 1, 8, 0, ENT Set ramp value to 3 deg/min
08 SET, PLATE TEMP (1), 8, 8, ENT Heat-up 88C
09 PLATE TEMP Display plate temperature
10 Wait Until, Wait Until, TIMER MIN:SEC (5), 8, 0, 0, ENT Priority to time (--> 87 C)
11 SET, PLATE TEMP (1), 9, 0, ENT set target plateau #2
12 Wait Until, Wait Until, TIMER MIN:SEC (5), t2+2, 0, , 0,ENT Priority to time t1 plateau #1 (t2 + 2 min.)
13 SET, Ramp/HR (8), 1, 2, 0, ENT Set cooling down to -2 deg/min
14 SET, PLATE TEMP (1), 4, 5, ENT Cool down for next run
15 Wait Until, Wait Until, TIMER MIN:SEC (5), t2+2, 0, , 0,ENT Cool-down to 60C with RUN lamp on
07 SET, TIMER HR:MIN (4), 1,2, ENT Start a timer for process control
08 TIMER MIN:SEC Display timer in MIN:SEC format


CMI specifications:

  • Use with protection Al foil only. Change it if unexpected contamination  or damage are visible.
  • close shield cover as soon as possible
  • 5 wafers 4" can be treat4ed simultaneously
  • Do not set plate temperature above 220C

DATAPLATE specifications

  • Heater temperature 0 to 370 C
  • RAMP 1-55 deg Celsius/hour
  • Timer min or sec resolution step
  • Single non-volatile register program memory
  • Size 25x25cm