Reservation  -     

Center of MicroNanoTechnology CMi

Etching

Ion beam etching

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   Veeco Nexus IBE350, ion beam etcher, argon source
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Plasma etching

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   STS Multiplex ICP, dry etcher, chlorine and bromine chemistry
   Alcatel AMS 200 SE, dry etcher, fluorine chemistry
   SPTS APS Dielectric Etcher, dry etcher, fluorine chemistry
   Oxford PRS900, dry etcher, oxygen plasma
   Tepla 300, dry etcher, oxygen plasma
   Tepla GiGAbatch, dry etcher, oxygen plasma
   TEL Unity Me, dry etcher, fluorine chemistry
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Grinding / Polishing

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   Steag Mecapol E 460, Chemical Mecanical Polishing (CMP)
   DAG810, automatic surface grinder
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Gas etching

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   Idonus HF VPE-100, Hydrofluoric acid vapor phase etcher - 49% HF chemistry, " Static etch " puddle configuration, Atmospheric pressure
   SPTS uEtch, Hydrofluoric acid vapor phase etcher - Anhydrous 99% HF chemistry, " Dynamic etch " pulsed configuration, Variable pressure
   XeF2 Silicon etching system
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Wet etching

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   UFT Piranha, wet bench, organics/residues stripping
   UFT Resist, wet bench, resist stripping
   Plade Oxide, wet bench, oxide etch
   Plade Metal, wet bench, metal etch
   Plade Six Sigma, wet bench, anisotropic silicon etching (KOH)
   Coillard and Tousimis Automegasamdri 915B, wet bench, HF release
   Coillard etching, wet bench, oxide and metal etch
   Coillard Photolithography, wet bench, resist strip and develop
   Arias Acid, wet bench
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