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Center of MicroNanoTechnology CMi

CMP (Chemical Mechanical Polishing)

CMP

Attention To be read first:
  • SAFETY OPERATOR MANUAL (HERE) / PROCÉDURE DE SÉCURITÉ POUR OPÉRER SUR LES WETBENCH DU CMI A LIRE OBLIGATOIREMENT (ICI)
  • Printer friendly version (here)

The use of the CMP always includes these 5 following steps: CMI

  1. Startup of machine STEAG MECAPOL E460
  2. Setting of the polishing parameters steps
  3. Starting the polishing
  4. Starting the conditioning
  5. Stopping the machine
It is important to proceed to a conditioning before each polishing. There are 3 different sets of plates/heads/conditioning rings, depending on the polishing type:

I. Startup of machine STEAG MECAPOL E460 CMI

  1. Log on
  2. Turn the machine on with the main switch (Fig. 1)
  3. Behind the machine, get out the tube from the bucket with water, and replace it in the appropriate bucket of slurry (Fig. 2)

  4. front view back view
    Fig. 1 Fig. 2


  5. Take off the carpet covering the plate (Fig. 3), and then place the polishing head in after humidifying the joint and head and the conditioning head (Fig. 4)
  6. Fig. 3 Fig. 4
    (ATTENTION : For Copper, take off the support of the conditioning head)

  7. Change to manual mode (red square button "off" Fig. 5) and then rinse the line by pushing START (green round button, regulate slurry's flow on 7-8). Once you see the slurry flowing (whitish color), push STOP and return to automatic mode by pushing the same red square button (this one will light up when on automatic)

II. Setting of the polishing parameters steps CMI

  1. When you are on automatic mode, the polishing is done in 3 steps
    1. Contacting of the head on the polishing (Landing) - no regulation
    2. The polishing is caracterized by:
      1. A pressure
      2. A rotating speed of the plate
      3. A rotating speed of the head
      4. A polishing duration
    3. Rinsing with DI water no regulation
  2. The regulation (automatic mode switched on) of the pressure is done by pushing the blue square button corresponding or to the 2 step (2 triangles tips down) or to the step 3 (3 triangles tips down) and by adjusting the value with the wheel located above the triangles on the right of the machine (see Fig. 5)
  3. The regulation of the rotating speeds of the head and the plate (pad) are done by pushing on the blue square button corresponding or to the 2 step (2 triangles tips down) or to the step 3 (3 triangles tips down) and by adjusting the value with the wheel located above the triangles on the left of the machine (see Fig. 6)
  4. Once the regulation of the parameters is done, release the blue button


Fig. 5

III. Starting the polishing CMI

  1. The machine is kept on automatic mode (red square button "light on")
  2. Switch to "polishing" mode (Fig.6)
  3. Place with the substrat support the wafer (Front side down) on the polishing head while aspirating it (turn button "vacuum" arrow looking up)
  4. Remove the support and push START
  5. Once the polishing is finish, recover the wafer by inflating the wafer (turn button "vacuum" arrow looking down, then
  6. Rince the wafer in the water tank overflow and dry the wafer with the spinner
REMARK : It is strongly recommended to proceed to about 3 to 5 polishings with wafers "dummies" to stabilize the operating conditions of the machine.

IV. Starting the conditioning CMI

  1. The machine is kept on automatic mode (red square button "light on")
  2. Switch to conditioning mode as shown on Fig. 6
  3. Push for 5 seconds the green square button (no regulations to do)

AMS 200 DSE
Fig. 6

REMARK : If the red button lights on, please contact the STAFF

V. Stopping the machine CMI

  1. Switch to manual polishing mode (red button "light off")
  2. Regulate the flow on the slurry to about 7-8
  3. Push START and go behind the machine
  4. Take verticaly the tube and clean it, then rinse well the inside of the tube with water
  5. Replace the tube in the bucket of water, and do this rinsing operation again if this one is not clean (clear)
  6. Go back in front of the machine and push the red button STOP when tere is only water flowing
  7. Rinse the head, remove it and rinse it again
  8. Replace the carpet and remove the conditioning head
  9. Place the polishing head in the bucket full of water, that is on the shelf next to the CMP. Place the conditioning head on the carpet and humidify it. Replace also the beaker of water under the pipes for the slurry and water flowing (the beaker must be full of water)
  10. Switch off the machine by turning the red button STOP
  11. Log off