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Tepla GiGAbatch plasma stripper user manual

Contents: CMI

  1. Introduction
  2. Equipment description
  3. Standard processes
  4. How to use the system
  5. Allowed materials
  6. Forbidden processes

I. Introduction CMI

The Tepla GiGAbatch uses high frequency plasma. Main applications are:


Materials that deteriorate easily upon exposure to oxygen (Ag, Cu, Cr, Fe,...) should not be processed in this machine!
This equipment is NOT micro-electronic compatible. For micro-electronic compatibility, please use Oxford PRS900 (zone 2).

II. Equipment description CMI

GiGAbatch

Quartz primary vacuum chamber (dimension: Dint. 245 mm x Prof. 380 mm)
Plasma frequency: 2.45 GHz
Plasma power:  200 to 600 W
Gas : O2 ( max. flow 1000 ml/min)
Quartz holders for 25 wafers from 75 mm to 100 mm

GiGAbatch Quartz boat

III. Standard processes CMI

RESIST STRIP HIGH POWER

Programs: PR_Strip_High_xx
Power: 600W
O2 flow: 400sccm
Pressure: 0.8mbar
Time: 1min to 30min
Uniformity: 20% to 30% depending on process time

Positive resists etch rate 250nm/min to 1.2um/min depending on process time + the number of wafers to be processed in the batch.

RESIST STRIP LOW POWER

Programs: PR_Strip_Low_xx
Power: 200W
O2 flow: 200sccm
Pressure: 0.5mbar
Time: 10sec to 15min
Uniformity: 20% to 30% depending on process time

Positive resists etch rate 100nm/min to 500nm/min depending on process time + the number of wafers to be processed in the batch

IV. How to use the system CMI

The substrates are processed following this procedure:
  1. Login on the GiGAbatch plasma stripper on zone 2 computer
  2. Login on the system using "Menu" and "Login". Username: 1 and Password: 1
  3. The machine is on stand-by mode ("Idle" mode). Kill this mode by pressing the "Abort" button
  4. Vent the machine using the "Vent" button
  5. Once at atmospheric pressure, open the door and put your wafers in the Quartz boat. CAUTION, it is very fragile!
    The Quartz boat stays in the machine. DO NOT take it out
    Materials that deteriorate easily upon exposure to oxygen (Ag, Cu, Cr, Fe,...) should not be processed in this machine!
  6. Select the program: use the arrows to red select the "Recipe" white box on main window. Press "Enter" to access the list. Make your choice in the menu and press "Enter" to validate
  7. Start the process by pressing "Run" (close the door to start the pumping). You can stop the process at anytime by pressing "Abort"
  8. During the process, press "Menu" and "Graph" to access the plasma intensity graph (purple line). Press twice the back button to return to main window (left button of the main menu bar)
  9. The chamber returns automatically at atmospheric pressure
  10. Once the chamber is at atmospheric pressure, take back your substrates (CAUTION, it may be hot)
    The Quartz boat stays in the machine. DO NOT take it out
  11. Check the cleanliness of the chamber
  12. Put the equipment in stand-by mode: press once the right button of the main menu bar to access "Vacuum idle" (close the door to start the pumping)
  13. Perform GiGAbatch logout on zone 2 computer

V. Allowed materials CMI

Wafers: Si, glass, Pyrex, without metallic layers if possible.
Materials that deteriorate easily upon exposure to oxygen (Ag, Cu, Cr, Fe,...) should not be processed in this machine!
Plastics foils: Caution, special holder and limited power (material fusion)

VI. Forbidden processes CMI

Processes that use the following equipments: These processes must use the Oxford plasma (zone 2)