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EPFL > CMI > Process - cleaning

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Equipment

Ebeam lithography
Photolithography
Etching
Thin films
Metrology
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III/V Lab at IPEQ

Process

Materials

Ebeam lithography
Photolithography
Etching
Cleaning

SPC

Restricted area

Cleaning

Dry
- Oxygen plasma
  - Z2 - Oxford
  - Z5 - Tepla 300
Wet
- Solvent
  - Z2 - UFT Resist
  - Z6 - Coillard Photo
- Acids
  - Z2 - UFT Pirahna
  - Z3 - RCA

© 2008 EPFL, 1015 Lausanne,
contacts Update: 02.07.2009